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产品简介

World fastest and best test coverage AXI system for PCB SMT assembly line

•Advanced Technologies

•Image Quality

•Improve Test Coverage

•Ease of Buy Off

•Speed Improvement

•3D CT Image

•Auto Reject


Allowable Panel Characteristics **

V810i S2EX

V810i S2 XXL

V810i S2 XLT

Maximum panel size

482 mm x 610 mm (19"x24")

660 mm x 965 mm (26"x38")

660 mm x 965 mm (26"x38")

Minimum panel size

76 mm x 76 mm (3" x 3" )

76 mm x 76 mm (3" x 3" )

76 mm x 76 mm (3" x 3" )

Maximum panel inspectable area

474 mm x 610 mm (18.7"x24")

654 mm x 965 mm (25.75"x38")

654 mm x 965 mm (25.75"x38")

Maximum panel thickness

7 mm (276 mils)

12.7 mm (500 mils)

12.7 mm (500 mils)

Minimum panel thickness

0.5 mm (20 mils)

0.5 mm (20 mils)

0.5 mm (20 mils)

Panel warp

Downside < 3.3 mm; Upside < 1.5 mm

Downside < 3.3 mm; Upside < 3.3 mm

Downside < 3.3 mm; Upside < 3.3 mm

Maximum panel weight

4.5kg

15kg

15kg

Board top clearance

50 mm @ 23 µm resolution
38 mm @ 19 µm resolution
38 mm @ 10.5 µm# resolution
11 mm @ 11 µm resolution
11 mm @ 6 µm# resolution
* Calculated from Board Top surface

25 mm @ 19 µm resolution
15 mm @ 13 µm resolution
* Calculated from Board Top surface

50 mm @ 19 µm resolution
31 mm @ 15 µm resolution
13 mm @ 11 µm resolution
31 mm @ 10 µm resolution
13 mm @ 7.5 µm resolution
* Calculated from Board Top surface

Board bottom clearance

70 mm

80 mm

80 mm

Panel edge clearance

3 mm

3 mm

3 mm

Panel width tolerance

±0.7 mm

±0.7 mm

±0.7 mm

System resolution

23 µm/19 µm#, 11 µm, 10.5µm, 6µm#

19 µm/13 µm

19 µm/15 µm /11 µm/10µm/7.5 µm

100% Press-fit testability

Yes (With PSP2 feature)

Yes (With PSP2 feature)

Yes (With PSP2 feature)

Maximum acceptable panel temperatures

40 Deg C

40 Deg C

40 Deg C

Power and Environmental


System footprint (Width X Depth X Height)

1566 mm x 2145 mm x 1972 mm

2240 mm x 2460 mm x 1980 mm

2240 mm x 2460 mm x 1980 mm

Weight

~3500 kg

~5500 kg

~6000 kg

*Note:
1. Assuming pad width is 50% of pitch.
2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board.

#2x2 binning camera configuration. Hardware upgrade is required on old system. 

**Note:
1. Panels are handled on width edges. Panels with edge cut outs may require the use of a carrier.
2. Maximum panel size dimensions and weight must include carrier if applicable.
3. Smaller panels are possible with the use of panel carriers.
4. With panels of this thickness, imaging results can be affected by PCBA layout.
5. Measured from the bottom of the panel including a maximum warp.


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